The Harris Products Group SB831 (TTT589) is a premium, high-strength tin-silver lead-free solder engineered for robust industrial joining applications. It consistently forms strong, ductile connections across a variety of base metals including copper, brass, steel, and stainless steel.
Key Specifications and Features:
– Alloy Composition: A high-strength 94% Tin / 6% Silver lead-free alloy.
– Material Compatibility: Engineered to provide strong, ductile connections on copper, brass, steel, and stainless steel.
– Connection Integrity: Produces an overall component with greater strength than typical brazed components, which can experience base metal weakening from annealment.
– Aesthetic Finish: The solder exhibits a silver color that provides an excellent visual match, particularly for stainless steel applications.
– Performance Characteristics: Offers excellent strength and flow characteristics for reliable joints.
– Compliance: Formulated as a lead-free solder for environmental and application safety requirements.