The Harris Products Group SB51 (NT230) is a premium lead-free solder engineered for robust industrial applications requiring high-integrity joints. It is recognized as an industry standard for HVAC connections, providing superior bonding across a wide range of ferrous and nonferrous metals.
Key Specifications and Features:
– Composition: Formulated with 96% Tin and 4% Silver for optimal performance and strength.
– Material Type: Lead-Free composition ensures compliance and safety in various industrial environments.
– Wire Diameter: Precision-manufactured with a 0.09375-inch wire diameter for consistent application.
– Core Type: Features a solid core design, facilitating reliable material deposition.
– Versatile Bonding: Capable of creating strong bonds with all types of ferrous and nonferrous alloys.
– Connection Integrity: Engineered to deliver strong, ductile connections, enhancing overall joint durability and resistance.
– Broad Material Compatibility: Effectively joins common industrial materials including copper, brass, steel, and stainless steel.